Product Products
Products / Products
  • 2017 - 06 - 26
    IMN1-DDR3 1333 4GB  Applicable model: laptop capacity:4GB Modular specification: 204Pin so-dimm Frequency: 1333 Production specification: JEDEC Working temperature: 0 ° C to 85 ° C Voltage: 1.35 V + / - 0.06 V Product size: standard 1.18 inch height
    Market price:
    0
    Member price:
    0
  • 2017 - 06 - 26
    IMP1-DDR3 1333 4GB   Model: IMP1 - DDR3 1333 4GB capacity:4GB Type: DDR3 1333 u-dimm Interface: 240 - pin Design: DDR3 JEDEC Working temperature: 0 ° C to 85 ° C Voltage: 1.5 V + / - 0.06 V Product size: 1.23 inch high
    Market price:
    0
    Member price:
    0
  • 2017 - 06 - 22
    eMMCICMAX eMMC has high efficiency, high speed, high compatibility and constant stability Characteristic, bring to customer not only safe, have acme of experience more. ICMAX eMMC has IDA, ECC, CRC, power failure protection, firmware Backup, global balanced wear and other features can greatly improve product compatibility and stability, Ensure the performance of customer products. ICMAX eMMC controller software is completely targeted by senior control team Develop and debug the research, and provide the most timely and effective technology for the customers with the professional FAE team Skill support and service.
    Market price:
    0
    Member price:
    0
  • 2017 - 06 - 26
    IMN1-DDR3 1333 8GB   Applicable model: laptop capacity:8GB Modular specification: 204Pin so-dimm Frequency: 1333 Production specification: JEDEC Working temperature: 0 ° C to 85 ° C Voltage: 1.35 V + / - 0.06 V Product size: standard 1.18 inch height
    Market price:
    0
    Member price:
    0
  • 2017 - 06 - 26
    IMP1-DDR3 1333 8GB  Model: IMP1 - DDR3 1333 8GB capacity:8GB Type: DDR3 1333 u-dimm Interface: 240 - pin Design: DDR3 JEDEC Working temperature: 0 ° C to 85 ° C Voltage: 1.5 V + / - 0.06 V Product size: 1.23 inch high
    Market price:
    0
    Member price:
    0
  • 2017 - 05 - 17
    eMCP  ICMAX eMCP product USES the high performance control, and advanced original NAND Flash chip BGA encapsulation technology to integrate eMMC and LPDDR precision packaging, so as to realize the integration of small volume, big data after efficient, intelligent. ICMAX eMCP eMMC parts, in the original IDA, ECC, CRC, power-off protection, firmware, backup, balanced and wear properties, which can effectively help customers improve efficiency, reduce the cost, improve the user experience, to improve the sustainability and stability of the product; LPDDR part compared with general computer memory has small volume, low power consumption advantages, while significantly reduce the power consumption of the customer product machine can provide fast and efficient variable storage.
    Market price:
    0
    Member price:
    0
  • 2017 - 06 - 26
    IMN2-DDR3 1600 4GB  Applicable model: laptop capacity:4GB Module specification: 204Pin so-dimm Frequency: 1600 Production specification: JEDEC Working temperature: 0 ° C to 85 ° C Voltage: 1.35 V + / - 0.06 V Product size: standard 1.18 inch height
    Market price:
    0
    Member price:
    0
  • 2017 - 06 - 26
    IMP2-DDR3 1600 4GB  Model: IMP2 - DDR3 1600 4GB capacity:4GB Type: DDR3, 1600 u-dimm Interface: 240 - pin Design: DDR3 JEDEC Working temperature: 0 ° C to 85 ° C Voltage: 1.5 V + / - 0.06 V Product size: 1.23 inch high
    Market price:
    0
    Member price:
    0
  • 2017 - 05 - 23
    LPDDR The ICMAX LPDDR is based on the JEDEC standard specification, which supports PoP stack packaging and independent packaging to meet the needs of different types of mobile devices. ICMAX LPDDR by ICMAX specialized research and development technical team timely follow up and validation of new technologies, such as LPDDR3 introduced two new technologies, to ensure that customers meet the demand of customer experience and the first time. - Write - Leveling and CA Training (Write balanced with instruction address Training) : allows the memory controller compensating signal deviation, ensure the memory to run on the industry to enter the bus speed at the same time, maintain the data input set, instructions and address input sequence both meet the demand. - On Die Termina...
    Market price:
    0
    Member price:
    0
  • 2017 - 06 - 26
    IMN2-DDR3 1600 8GB   Applicable model: laptop capacity:8GB Module specification: 204Pin so-dimm Frequency: 1600 Production specification: JEDEC Working temperature: 0 ° C to 85 ° C Voltage: 1.35 V + / - 0.06 V Product size: standard 1.18 inch height
    Market price:
    0
    Member price:
    0
  • 2017 - 06 - 26
    IMP2-DDR3 1600 8GB  Model: IMP2 - DDR3 1600 8GB capacity:8GB Type: DDR3, 1600 u-dimm Interface: 240 - pin Design: DDR3 JEDEC Working temperature: 0 ° C to 85 ° C Voltage: 1.5 V + / - 0.06 V Product size: 1.23 inch high
    Market price:
    0
    Member price:
    0
  • 2017 - 05 - 21
    2.5 inch SSD  Product type: s710-32lx Interface: SATA III 6Gb/s Form: 2.5 "(7mm) 32 gb capacity: R/W Speed: 340MB/s: 85MB/s. Working temperature: 0 ℃ ~ 70 ℃
    Market price:
    0
    Member price:
    0
Total28ArticlePage1/3HomePrevious123NextLast page
Links

Copyright ©2017-2020   深圳市宏旺微电子有限公司
犀牛云提供企业云服务
×